HIROSAKI's M705 solder wire brings a silver-bearing, lead-free alloy to precision soldering work that demands both reliability and clean electrical performance. Formulated to the well-known M705 specification - 96.5% tin, 3.0% silver, and 0.5% copper - this wire melts at a controlled 217°C, giving hobbyists and technicians a fast, even flow with less thermal stress on sensitive components than higher-temperature alternatives.

A 2.2% integrated rosin flux core is built into every strand, so joints wet out smoothly with minimal spatter and low, easy-to-clean residue - no separate flux application needed for most work. The added silver content improves conductivity and joint strength compared to plain tin-copper lead-free wire, which is why this alloy is a long-standing favourite among mechanical keyboard builders soldering hot-swap PCBs and audio/Hi-Fi enthusiasts assembling or modifying amplifiers, DACs, and crossovers. Each roll is fully lead-free and RoHS compliant, manufactured to consistent spool winding for smooth, tangle-free feed during use.

Key Features:
Alloy: Sn96.5 / Ag3.0 / Cu0.5 - low melting point, silver-enhanced conductivity and joint strength
217°C melting point for fast, controlled soldering with reduced thermal stress on components
2.2% integrated rosin flux core - smooth flow, minimal spatter, low residue
RoHS compliant, lead-free; SGS-tested per manufacturer documentation
Suited to fine-pitch PCB rework, mechanical keyboard hot-swap builds, and precision electronics repair

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